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Improving Semiconductor Reliability with Advanced Engineering Methods in Test Program Development

Vock, S, Escalona, OJ and Turner, C (2015) Improving Semiconductor Reliability with Advanced Engineering Methods in Test Program Development. Journal of Electronic Testing Theory and Applications, 31 (1). pp. 107-117. [Journal article]

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URL: http://link.springer.com/article/10.1007%2Fs10836-014-5495-z

DOI: 10.1007/s10836-014-5495-z

Abstract

Advancing semiconductor technology in combination with new assembly and packaging technologies areunfolding a new level of challenges for production testing. Reliability of semiconductors should be ensured by applying dedicated techniques within production testing addressing various aging aspects such as: device wear-out related degradation or reduced operational voltage headroom. Thus, test program quality is emerging as a major concern, as it is directly translating into microelectronics reliability and devices quality. With the heightened sensitivity of semiconductor technology to smallest deviations in test methods from the allowed operational range, the risk of accidentally degrading the integrated circuits reliability increases significant. In this paper we propose an approach that addresses the demand for improving semiconductor technology reliability production tests quality. The presented industry usage based case studies, in combination with described techniques, provide a set of valuable practical guidelines.

Item Type:Journal article
Keywords:Accelerated life testing; reliability; semiconductor aging; test equipment; testing; time to market, test engineering standards.
Faculties and Schools:Faculty of Computing & Engineering
Faculty of Computing & Engineering > School of Engineering
Research Institutes and Groups:Engineering Research Institute
Engineering Research Institute > Nanotechnology & Integrated BioEngineering Centre (NIBEC)
ID Code:31859
Deposited By: Professor Omar Escalona
Deposited On:22 Jun 2015 13:22
Last Modified:22 Jun 2015 13:22

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