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Semiconductor wafer comprising micro-machined components

Analog Devices Inc. (2004) Semiconductor wafer comprising micro-machined components. [Patent]

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URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=blackstone.INNM.&s2=analog.ASNM.&OS=IN/blackstone+AND+AN/analog&RS=IN/blackstone+AND+AN/analog


A semiconductor wafer having a matrix array of micro-mirrors comprises a component substrate carried on a base substrate. The component substrate comprises a membrane layer in which the micro-mirrors are formed and a supporting handle layer. The base substrate comprises a base layer from which a plurality of pedestals extend upwardly therefrom into cavities in the handle layer corresponding to the micro-mirrors. Each pedestal carries electrodes for co-operating with the micro-mirrors for tilting thereof. Conductors through vias in the pedestals connect the electrodes to electrically conductive tracks on a bottom surface, and in turn through conductors through vias to addressing terminals for addressing the electrodes. By forming the pedestals in the base substrate and projecting the pedestals into the cavities in the handle layer the handle layer is recessed into the base substrate thereby facilitating the provision of a handle layer of depth sufficient for adequately supporting the membrane layer during fabrication of the wafer.

Item Type:Patent
Faculties and Schools:Faculty of Computing & Engineering
Faculty of Computing & Engineering > School of Engineering
Research Institutes and Groups:Engineering Research Institute
Engineering Research Institute > Nanotechnology & Integrated BioEngineering Centre (NIBEC)
ID Code:6688
Deposited By: Dr Alan Brown
Deposited On:21 Jan 2010 13:26
Last Modified:18 Aug 2011 10:08

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