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Low resistance transparent electrodes for large area flat display devices

Laverty, SJ and Maguire, PD (2001) Low resistance transparent electrodes for large area flat display devices. Journal of Vacuum Science and Technology B, 19 (1). pp. 1-6. [Journal article]

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DOI: 10.1116/1.1335676


The dynamic performance of large area, high-resolution flat panel displays is contingent upon the conductivity of the transparent electrode. Electroplated copper and vacuum deposited aluminum bus bars attached to the sidewalls of conventional SnO2 electrodes offer theoretical improvements in conductivity while maintaining the electrode transmittivity. In association with a reactive ion etching process for delineating t he tin oxide, auto registration methods for attaching copper by electroplating and aluminum by a resist lift off process are described, together with the achieved enhancement factors. A contact resistance between the aluminum and the tin oxide was found to significantly reduce the enhancement. The sidewall contact resistance lies between 0.4 and 4.0 3104 V mm2, considerably lower than that previously reported for contacts to the tin oxide top surface. The enhancement factor for aluminum lies between two and three. The application of copper did not suffer from a contact resistance and an order of magnitude enhancement was obtained. We also report excellent adhesion, typically greater than 200 kg/cm2, of the metals to the tin oxide and identify the parametric space for achieving this.

Item Type:Journal article
Faculties and Schools:Faculty of Computing & Engineering
Faculty of Computing & Engineering > School of Engineering
Research Institutes and Groups:Engineering Research Institute
Engineering Research Institute > Nanotechnology & Integrated BioEngineering Centre (NIBEC)
ID Code:7526
Deposited By: Professor Paul Maguire
Deposited On:18 Jan 2010 12:00
Last Modified:17 Oct 2017 15:41

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